WATERPACK
Desenvolvimento de embalagens alimentares biodegradáveis solúveis...
The NewSoldex project – New Solder Paste Solutions from Nevex – aims to develop new formulations of solder pastes for the electronic industry, based on metal tin, silver and copper alloys (SAC alloys) suspended in fluxes classified as “No Clean”. The new solder pastes are lead-free and comply with the restriction of hazardous substances directives.
The project aims to help fill a gap in the national industry, allowing national companies to produce materials that can only be purchased abroad.
Developed projects
Desenvolvimento de embalagens alimentares biodegradáveis solúveis...
Improved conservation characteristics
With compostable materials
Disruptive innovation and science
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